Asymmetric 3D-printed PEG porous frame composited with functional materials for high electromagnetic shielding and infrared stealth performance.

The development of multifunctional composites integrating electromagnetic interference (EMI) shielding and infrared (IR) stealth properties holds significant research value and application potential. In this work, we pioneer a novel fabrication strategy combining digital light processing (DLP) three-dimensional (3D) printing with click chemistry to create MXene-enhanced poly (ethylene glycol) porous polymer (MWPP) composites with asymmetric structure. Through unique structural design of top holes and bottom solid, it exhibits excellent impedance matching and EMI shielding in the X-band, with an EMI shielding effectiveness (EMI SE) of 30.71-38.91 dB (>99.9 %) while demonstrating an absorption-dominated shielding mechanism with remarkable absorptivity (A) of 0.76, absorptivity/reflectivity (A/R) ratio of 3.48 and effective absorption rate (Aeff) > 0.99. In addition, the synergistic effect of temperature control layer and low emissivity (0.291, 8-14 μm) endows MWPP with excellent IR stealth property, with an equilibrium IR radiation temperature of only 38.2 °C on a 100 °C hot target. Moreover, the incorporation of functional slurry effectively addressed the inherent mechanical limitations of photocurable 3D-printed products. MWPP demonstrated a compressive strength of 1.113-1.171 MPa (at 50 % strain), enabling it to withstand loads approximately 11,000 times its own weight. Even after 100 compression-recovery cycles, its stress retention rate remains as high as 94.51 %. This work pioneers the application of photo-curing 3D printing in dual-spectrum stealth materials while establishing a modular design paradigm for customizable multifunctional composites. The breakthrough technology shows revolutionary potential for security systems, aerospace engineering, and military applications, particularly in developing adaptive camouflage systems and electromagnetic protection devices.